Dynamic Stress and Strain of HPC Under Drop-weight Impact Loading. Jurnal Teknologi, [S. l.], v. 65, n. 2, 2013. DOI: 10.11113/jt.v65.2187. Disponível em: https://journals.utm.my/jurnalteknologi/article/view/2187.. Acesso em: 23 jul. 2024.