Wetting Properties of Sn–Pb, Sn–Zn and Sn–Zn–Bi Lead–Free Solders. Jurnal Teknologi, [S. l.], v. 46, n. 1, p. 1–14, 2012. DOI: 10.11113/jt.v46.285. Disponível em: https://journals.utm.my/jurnalteknologi/article/view/285.. Acesso em: 23 jul. 2024.