TEMPERATURE DISTRIBUTION ANALYSIS IN PARALLEL PLATE TREATMENT CHAMBER FOR PULSED ELECTRIC FIELD PROCESSING: NUMERICAL STUDY. ASEAN Engineering Journal, [S. l.], v. 12, n. 3, p. 63–69, 2022. DOI: 10.11113/aej.v12.16551. Disponível em: https://journals.utm.my/aej/article/view/16551.. Acesso em: 6 apr. 2025.