TEMPERATURE DISTRIBUTION ANALYSIS IN PARALLEL PLATE TREATMENT CHAMBER FOR PULSED ELECTRIC FIELD PROCESSING: NUMERICAL STUDY

Authors

  • Nur Faizal Kasri School of Electrical Engineering, Faculty of Engineering, Universiti Teknologi Malaysia, 81310, UTM Johor Bahru, Johor, Malaysia
  • Mohamed Afendi Mohamed Piah School of Electrical Engineering, Faculty of Engineering, Universiti Teknologi Malaysia, 81310, UTM Johor Bahru, Johor, Malaysia
  • Zuraimy Adzis School of Electrical Engineering, Faculty of Engineering, Universiti Teknologi Malaysia, 81310, UTM Johor Bahru, Johor, Malaysia
  • A. Hamzah School of Electrical Engineering, Faculty of Engineering, Universiti Teknologi Malaysia, 81310, UTM Johor Bahru, Johor, Malaysia

DOI:

https://doi.org/10.11113/aej.v12.16551

Keywords:

Flow pattern, Numerical simulation, Parallel plate treatment chamber, PEF, Temperature distribution

Abstract

Studies on temperature distribution in parallel plate treatment chambers are limited due to its design which is more prone to arcing, thus, neglecting its use in continuous processing. Therefore, this study discusses the temperature distribution due to Joule heating in a parallel plate treatment chamber acting in continuous mode. The numerical results predict that at a slow flow rate (i.e., 0.0234 cm3/s), the fluid flow near the chamber wall is in a static state (0 cm/s), thus, increasing its residence time and resulting in receiving more pulses. In this situation, the temperature increased dramatically from 25 °C (inlet temperature) to approximately 58 °C, i.e., 132 % increment. On the other hand, a slight increase in temperature (i.e., < 27 °C) is predicted by numerical simulation at a higher flow rate (i.e., 0.138 cm3/s) at the same location (near the chamber wall). This less rise is due to the low residence time which causes the liquid to quickly leave the treatment area, thus, getting less pulse. The temperature soar in this condition is very low which is approximately 8 % of the inlet temperature. From the results obtained, flow rate control helps to reduce the temperature rise, thus, keeping the temperature at ambient temperature or slightly above the ambient and at the same time reducing the risk of the treated media from experiencing adverse effects on its physical attributes as a result of high temperatures.

Author Biographies

  • Nur Faizal Kasri, School of Electrical Engineering, Faculty of Engineering, Universiti Teknologi Malaysia, 81310, UTM Johor Bahru, Johor, Malaysia

    Nur Faizal Kasri (N. F. Kasri) is a PhD student at School of Electrical Engineering, Universiti Teknologi Malaysia and a fellow member of the Institute of High Voltage and High Current (IVAT). He received the B. Mechatronic. Eng. degree from Universiti Teknologi Malaysia in 2011, M. Sc in Elect. Eng. also from Universiti Teknologi Malaysia in 2014. He was appointed as a part-time lecturer in UiTM Pasir Gudang from 2014-2015 before pursuing his PhD study. He has been involved in testing and calibration of high voltage equipment, insulation diagnostic and consultancy project with Tenaga Nasional Berhad dan Research (TNBR). His research interests include high voltage insulation diagnostic and co-ordination, electrical discharges, polymer nanocomposites insulating materials and insulator condition monitoring and food technology process.

  • Mohamed Afendi Mohamed Piah, School of Electrical Engineering, Faculty of Engineering, Universiti Teknologi Malaysia, 81310, UTM Johor Bahru, Johor, Malaysia

    Dr. M. Afendi M. Piah is an Associate Professor at Faculty of Electrical Engineering, Universiti Teknologi Malaysia and a fellow member of the Institute of High Voltage and High Current (IVAT). He received the B.Elect. Eng. degree from Universiti Teknologi Malaysia in 1986, M.Sc in Power System from University of Strathclyde, UK in 1990 and PhD in High Voltage Engineering from Universiti Teknologi Malaysia in 2004. He was appointed as an assistant director (Test and Calibration Division) of IVAT from 1996-2000 and Deputy Director of IVAT from 2007-2009. He has been involved in testing and calibration of high voltage equipments. His research interests include high voltage insulation diagnostic and co-ordination, electrical discharges, polymer nanocomposites insulating materials and insulator condition monitoring.

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Published

2022-08-31

Issue

Vol. 12 No. 3: September 2022

Section

Articles

How to Cite

TEMPERATURE DISTRIBUTION ANALYSIS IN PARALLEL PLATE TREATMENT CHAMBER FOR PULSED ELECTRIC FIELD PROCESSING: NUMERICAL STUDY. (2022). ASEAN Engineering Journal, 12(3), 63-69. https://doi.org/10.11113/aej.v12.16551