ELECTROLESS QUATERNARY NI-CU-CO-P ALLOY DEPOSITION MECHANISM IN ACIDIC BATH USING CYCLIC VOLTAMMETRY MEASUREMENT
DOI:
https://doi.org/10.11113/jt.v79.11273Keywords:
Electroless quaternary nickel alloy deposition, deposition mechanism, cyclic voltammetry, surface morphology, corrosion resistant coatingAbstract
Quaternary nickel alloy of Ni-Co-Cu-P has been successfully deposit on Fe substrate for corrosion resistant material. However, the reaction mechanism of quaternary nickel alloy deposition is less known and requires investigation. In this study, using similar bath component is used to produce electroless Ni-Cu-Co-P alloy. Cyclic voltammetry (CV) study is done in various plating bath component at bath pH 4.50, 4.75 and 5.00. A coating of Ni-Cu-Co-P alloy was deposited on a Fe substrate to evaluate surface morphology and composition. From CV results, higher bath pH, increases the [H2PO2-] oxidation peak and shifted the oxidation potential towards less noble potential. The reduction potential of the Ni alloy moved to noble potential, hence, elevate deposition rate from 3.95 to 5.95 mm/hr. The Ni-Cu-Co-P alloy composition on Fe substrate in descending manner is Ni (68.55 – 82.09 wt%), Cu (14.11 – 27.80 wt%) and Co (1.32 - 1.52wt%). The P content remained lower than 3.00 wt%. Hence, Co act as reaction inhibitor, while Cu act as both reaction accelerator and stabilizer.
References
G. O. Mallory, J. B. Hajdu. 1990. Electroless Plating: Fundamentals and Applications. AESF, Orlando, Florida.
Zaimi, M., Azam, M. A., Sofian, Azizul Helmi and Noda, K. 2015. Electrochemical Impedance Behavior of Various Composition Quaternary Ni Alloy in 3.5wt% NaCl. Applied Mechanics and Materials. 761: 401-411.
Georgieva, J. and Armyanov, S. 2003. Factors Affecting the Electroless Deposition of Ni-Cu-P Coatings. Journals of Electrochemical Society. 150(11): C760-C764.
Narayanan, T. S. N. Sankara, Selvakumar, S. and Stephen, A. 2003. Electroless Ni-Co-P Ternary Alloy Deposits: Preparation and Characteristics. Surface & Coatings. 172: 298-307.
Osaka, T. 1992. Electrochemical Aspects of Advanced Electronic Materials. Electrochimica Acta. 37(6): 989-995.
Zaimi, M. and Noda, K. 2013. Effect of Coating Thickness on Corrosion Behavior of Electroless Quaternary Nickel Alloy Deposit in 3.5wt% NaCl Solutions. Journal of Advanced Manufacturing Technology. 8(2): 83-92.
Abrantes, L. M. and Correla, J. P. 1994. On the Mechanism of Electroless Ni-P Plating. Journals of Electrochemical Society. 141(9): 2356-2360
Cui, G., Liu, H., Wu, G., Zhao, J., Song, S., amd Shen, K. S. 2008. Electrochemical Impedance Spectroscopy and First-Principle Investigations on the Oxidation Mechanism of Hypophosphite Anion in the Electroless Deposition System of Nickel. Journals of Physical Chemistry C. 112: 4601-4607.
Hung, A. and Chen, K. 1989. Mechanism of Hypophosphite-Reduced Electroless Copper Plating. Journals of Electrochemical Society. 136(1): 72-75.
Toda, A., Chivavibul, P. and Enoki, M. 2013. Effects of Plating Conditions on Electroless Ni-Co-P Coating Prepared from Lactate-Citrate-Ammonia Solution. Materials Transactions. 54(3): 337-343.
Zaimi, M., Azran. M. N., Khaizaki, M., Alif, M., Aziz, M. S. A., Azam, M. A., Kasim, M. S., Munawar, R. F. and Abd Manaf, M. E. 2016. Electroless Ni-Co-Cu-P Alloy Deposition in Alkaline Hypophosphite Based Bath. Key Engineering Materials. 694: 151-154.
Chassaing, E., Cherkaoui, M. and Srhiri, A. 1993. Journals Applied Electrochemistry. 23: 1169-1174.
Abdel Aal, A., Shaaban, A. and Hamid, Abdel 2008. Nanocrystalline Soft Ferromagnetic Ni-Co-P Thin Film on Al Alloy by Low Temperature Electroless Deposition. Applied Surface Science. 254: 1966-1971.
Van den Meerakker, J. E. A. M. 1981. On the Mechanism of Electroless Plating. II. One Mechanism for Different Reductants. Journals Applied Electrochemistry. 11: 395-400.
Bounanani, M., Cherkaoui, M., Cherkaoui, M., Belcadi, S., Fratesi, R. and Roventi, G. 1999. Ni-Zn-P Alloy Deposition from Sulfate Bath: Inhibitory Effect of Zinc. Journals Applied Electrochemistry. 29: 1171-1176.
Lee, Chwan-Ying and Lin, Kwan-Lung 1994. Ni-Cu-P and Ni-Co-P as a Diffusion Barrier between an Al Pad and a Solder Bump. Thin Solid Films. 239: 93-98.
Balaraju, J.N., Radhakrishnan, Praful, Ezhilselvi, V., Kumar, A. Anil, Chen, Zhong and Surendran, K.P. 2016. Studies on Electroless Nickel Polyalloy Coatings over Carbon Fibers/CFRP Composites. Surface & Coatings Technology. 3302: 389-397
Sudagar, Jothi, Lian, Jianshe and Sha, Wei 2013. Electroless Nickel, Alloy, Composite and Nano Coatings – A Critical Review. Journals of Alloys and Compounds. 571: 183-204.
Sahoo, Prasanta and Das, Suman Kalyan 2011. Tribology of Electroless Nickel Coatings – A Review. Materials & Design. 32(4): 1760-1775.
Downloads
Published
Issue
Section
License
Copyright of articles that appear in Jurnal Teknologi belongs exclusively to Penerbit Universiti Teknologi Malaysia (Penerbit UTM Press). This copyright covers the rights to reproduce the article, including reprints, electronic reproductions, or any other reproductions of similar nature.
