Effect of Soldier Bump Size On Interfacial Reactions During Soldering Between PB–Free Solder and Cu and Cu Ni/Pd/Au Surface Finishes

Authors

  • Nor Akmal Fadil
  • Ali Ourdjini
  • Azmah Hanim Mohamed Ariff
  • Siti Rabiatul Aisha Idris

DOI:

https://doi.org/10.11113/jt.v52.118

Abstract

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Published

2012-01-20

Issue

Vol 52 (May 2010)

Section

Science and Engineering

License

Copyright of articles that appear in Jurnal Teknologi belongs exclusively to Penerbit Universiti Teknologi Malaysia (Penerbit UTM Press). This copyright covers the rights to reproduce the article, including reprints, electronic reproductions, or any other reproductions of similar nature.

How to Cite

Effect of Soldier Bump Size On Interfacial Reactions During Soldering Between PB–Free Solder and Cu and Cu Ni/Pd/Au Surface Finishes. (2012). Jurnal Teknologi (Sciences & Engineering), 52(1), 1–12. https://doi.org/10.11113/jt.v52.118