EFFECT OF SN COMPONENT ON PROPERTIES AND MICROSTRUCTURE CU-NI-SN ALLOYS
DOI:
https://doi.org/10.11113/jt.v80.11867Keywords:
Spinodal decomposition, deformation mechanism, Cu-Ni-Sn alloy, mechanical property, microstructureAbstract
This paper investigates a high electrical conductivity and high strength of alloys based on Cu-Ni-Si system It proclaimed the results of the effect of tin (Sn) component on the mechanical properties and microstructure of Cu-Ni-Sn alloy. The conditions for processing the Cu-Ni-Si alloy were presented, the analysis of microstructure and mechanical properties after heat treatment was examined by X-ray, SEM, EDS and specialized machines. The results showed that with 3% mass of Sn added into the Cu-Ni-Sn alloy along with heat treatment and deformation, the hardness value reached the range of 221-240HV, the tensile strength and elastic limit reached around 1060MPa and 903MPa respectively. However, after heat treatment and deformation for the Cu-Ni-Sn alloy based on 6% mass of Sn, the hardness value reached the range of 221-318HV, the tensile strength and elastic limit were respectively 222MPa and 263MPa higher than those of the Cu-Ni-Sn alloy with 3% mass of Sn. The result from X-ray analysis showed the deflection of peaks. Nonetheless, the new phases were not observed in SEM and EDS, contrariwise, generated modular structure was considered as the proof of the Spinodal cluster. This fact might be explained by two mechanisms: deformation mechanism and Spinodal decomposition.
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