EVALUATION ON THE REDUCED GRAPHENE OXIDE THERMAL INTERFACE MATERIAL AND HEAT SPREADER FOR THERMAL MANAGEMENT IN HIGH-TEMPERATURE POWER DEVICE

Authors

  • Mohd Faizol Abdullah Advanced Devices Lab, MIMOS Berhad, Technology Park Malaysia, 57000 Kuala Lumpur, Malaysia https://orcid.org/0000-0001-6911-0716
  • Siti Aishah Mohamad Badaruddin Advanced Devices Lab, MIMOS Berhad, Technology Park Malaysia, 57000 Kuala Lumpur, Malaysia
  • Mohd Rofei Mat Hussin Advanced Devices Lab, MIMOS Berhad, Technology Park Malaysia, 57000 Kuala Lumpur, Malaysia
  • Mohd Ismahadi Syono Advanced Devices Lab, MIMOS Berhad, Technology Park Malaysia, 57000 Kuala Lumpur, Malaysia

DOI:

https://doi.org/10.11113/jurnalteknologi.v83.15102

Keywords:

Reduced graphene oxide, thermal interface material, heat spreader, thermal management, power devices

Abstract

Thermally conductive reduced graphene oxide (rGO) is desirable for removing generated heat during the operation of a power device. Excessive heat accumulation results in device failure. In this article, the performance of rGO as a thermal interface material (TIM) and heat spreader on Si substrate was evaluated using a custom build thermal test setup. By a simple drop-casting of graphene oxide (GO) on Si followed by 700 oC thermal reduction, a hybrid film of GO (electrical insulator) and rGO (thermal conductor) was obtained. This was verified by Raman spectra and surface morphological image. Approximately 300 nm-thick rGO film prepared from 4-times drop-casting of GO exhibited the highest performance as a TIM and heat spreader. The heating rate of Si increased from 14.85 oC/W to 18.37 oC/W due to the improved heat transfer from the heater into the Si substrate. The experimental results endorsed the effectiveness of rGO as a thermal solution and verified the capability of the thermal test setup as a thermal simulation of a high-power device.

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Published

2021-04-01

Issue

Section

Science and Engineering