THERMAL-INDUCED DAMAGE ON SOLDER JOINTS OF HIGH-DENSITY ADJACENT BALL GRID ARRAY COMPONENTS DURING THE REWORK PROCESS

Authors

  • Adlil Aizat Ismail ᵃWestern Digital®, SanDisk Storage Malaysia Sdn. Bhd., Plot 301A, Persiaran Cassia Selatan 1, 14100 Batu Kawan, Penang, Malaysia ᵇInstitute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, 43600 Bangi, Selangor, Malaysia
  • Maria Abu Bakar Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, 43600 Bangi, Selangor, Malaysia
  • Abang Annuar Ehsan Institute of Microengineering and Nanoelectronics, Universiti Kebangsaan Malaysia, 43600 Bangi, Selangor, Malaysia
  • Zol Effendi Zolkefli Western Digital®, SanDisk Storage Malaysia Sdn. Bhd., Plot 301A, Persiaran Cassia Selatan 1, 14100 Batu Kawan, Penang, Malaysia

DOI:

https://doi.org/10.11113/jurnalteknologi.v84.19321

Keywords:

Thermal induce damage, solder joint damage, adjacent BGA components, rework, infrared thermography

Abstract

Correlation between adjacent ball grid array (BGA) components' temperature and thermal-induced damage to their solder joints on both the top and bottom printed circuit board assembly (PCBA) sides during the rework process is studied in this work. Total often adjacent BGA components from the rework area on the top (F - K) and bottom (A - E) PCBA side were observed. The dye and pull (D&P) test results, infrared thermography images, and temperature measurements were analyzed for solder joint crack induced by the thermal damage with precise temperature measurement on each adjacent BGA component. Scanning electron microscope (SEM) analysis complemented the post-D&P test solder joint crack observation. The D&P test results shows that 76 % or higher and solder joint separation locations at the copper pad on BGA occurred when the temperature of the adjacent components of the rework location exceeded 195 °C and 210 °C on the centre and corner of the component, respectively.

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Published

2022-10-31

How to Cite

Ismail, A. A., Abu Bakar, M. ., Ehsan, A. A. ., & Zolkefli, Z. E. . (2022). THERMAL-INDUCED DAMAGE ON SOLDER JOINTS OF HIGH-DENSITY ADJACENT BALL GRID ARRAY COMPONENTS DURING THE REWORK PROCESS. Jurnal Teknologi, 84(6-2), 1-8. https://doi.org/10.11113/jurnalteknologi.v84.19321