Application of Packaging Technique in Fiber Bragg Grating Temperature Sensor for Measuring Localized and Nonuniform Temperature Distribution

Authors

  • Liau Qian Yu Faculty of Electrical Engineering, Universiti Teknologi Malaysia, 81310 Johor Bahru, Johor, Malaysia
  • Asrul Izam Azmi Faculty of Electrical Engineering, Universiti Teknologi Malaysia, 81310 Johor Bahru, Johor, Malaysia
  • Siti Musliha Aishah Musa Advanced Photonics Science Institute, Faculty of Science, Universiti Teknologi Malaysia, 81310 Johor Bahru, Johor, Malaysia
  • Raja Kamarulzaman Raja Ibrahim Advanced Photonics Science Institute, Faculty of Science, Universiti Teknologi Malaysia, 81310 Johor Bahru, Johor, Malaysia

DOI:

https://doi.org/10.11113/jt.v64.2084

Keywords:

Optical Sensor, Fiber Bragg Grating, Labview, packaging, low cost

Abstract

The development of Fiber Bragg Grating (FBG) sensing technique has improved significantly especially in the sensor head design and real-time data acquisition technique. This paper presents the development of a simple and cost effective packaging technique that further enhances the performances of the FBG sensor. The packaged FBG sensor overcomes the nonuniform heat distribution of a bare FBG that causes eccentric response of FBG spectrum. Therefore, the packaged FBG sensor could be operated for a localized area with high temperature differential. The packaging also compensates the unwanted strain effect from the surrounding which makes temperature measurement become more accurate. The experimental works have been successfully carried out to demonstrate the system operation and the packaging functionalities. The temperature sensitivity coefficient of the bare FBG sensor measured in experiment is 10.05 pm/°C, while the packaged fiber sensor is 10.09 pm/°C, which are expected from the design.

References

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Published

2013-09-15

Issue

Section

Science and Engineering

How to Cite

Application of Packaging Technique in Fiber Bragg Grating Temperature Sensor for Measuring Localized and Nonuniform Temperature Distribution. (2013). Jurnal Teknologi, 64(3). https://doi.org/10.11113/jt.v64.2084