CORRELATION BETWEEN SURFACE PROFILE PARAMETERS AND WETTING DYNAMICS OF SN-CU SOLDER ON MODIFIED COPPER SUBSTRATES

Authors

  • Bashir Temitope Balogun Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia (UKM), 43600 UKM Bangi, Selangor, Malaysia
  • Azman Jalar Department of Applied Physics, Faculty of Science and Technology, Universiti Kebangsaan Malaysia (UKM), 43600 UKM Bangi, Selangor, Malaysia
  • Maria Abu Bakar Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia (UKM), 43600 UKM Bangi, Selangor, Malaysia
  • Atiqah Mohd Afdzaluddin Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia (UKM), 43600 UKM Bangi, Selangor, Malaysia
  • M. N. S. M. Yusof Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia (UKM), 43600 UKM Bangi, Selangor, Malaysia

DOI:

https://doi.org/10.11113/jurnalteknologi.v88.24976

Keywords:

Sn-Cu solder, wetting dynamics, surface profile parameters, copper substrate, surface roughness, waviness, primary

Abstract

In the previous research, selection of substrate surface profile to optimize wetting is a problem. There is lack of quantitative data on the wetting dynamics of Sn-Cu solder on copper substrates This study investigates the correlation between surface profile parameters and wetting dynamics of Sn-Cu solder on modified copper substrates. In the past up till the present, this study profound solution by varying substrate surface profile using roughness, waviness, and primary profile parameters within the ranges from 400, 600, 800, 1000, 1200, and 2000µm. Excellent wetting angle of contact (18.58°, 32.02°, 22.73°, 23.26°, 26.05°, and 25.93°) were recorded which agreed with the literature of the ranging values ˃ 0 and < 90˚. These findings indicate that the wetting dynamics of Sn-Cu solder on modified copper substrates gives an optimal spreading on copper substrate surface. This is characterized by three distinct stages: initial vertical transport of molten solder, horizontal spreading within the droplet’s spherical diameter, and further horizontal extension influenced by modified copper substrates. A correlation equation was established between surface profile parameters and wetting dynamics of Sn-Cu solder with correlation coefficients of r = 0.18 (roughness), r = 0.11 (waviness), and r = 0.22 (primary), indicating that substrate surface profiles correlate with dynamics wetting angles with substrate surface profile (primary) most influences wettability. This work will bring an improvement in printed circuit board etching or soldering efficiency and metallurgical joining.

 

Author Biography

  • Azman Jalar, Department of Applied Physics, Faculty of Science and Technology, Universiti Kebangsaan Malaysia (UKM), 43600 UKM Bangi, Selangor, Malaysia

References

Abdullah, A., and S. R. Aisha Idris. 2023. A Review: Effect of Copper Percentage Solder Alloy after Laser Soldering. Soldering & Surface Mount Technology. 35(3): 175–188. https://doi.org/10.1108/SSMT-03-2022-0022.

Ma, T., Z. Zhang, S. Zhang, Y. Zhao, W. Shao, J. Huang, S. Chen, Z. Ye, W. Wang, and J. Yang. 2025. Influence and Mechanism of Ultrafast Laser-Textured Cu Substrate on Wetting Behavior of SAC305 Solder. Optics & Laser Technology. 182: 112190. https://doi.org/10.1016/j.optlastec.2024.11210.

Lv, X., Z. Wang, Z. Pan, C. Zhang, L. Cao, F. Sun, and Y. Liu. 2025. Research on the Interface Structure Composite Behavior and Performance Influence of Ni and Cr Elements in Sn–Cu–Bi Solder Microstructure. Journal of Materials Research and Technology. 36: 713–726. https://doi.org/10.1016/j.jmrt.2025.03.153.

Wang, H., K. Zhang, Y. Wu, and B. Wang. 2021. Study on the Correlation between Spreadability and Wetting Driving Force of Ni-GNSs Reinforced SnAgCuRE Composite Solder. Materials & Design. 212: 110222. https://doi.org/10.1016/j.matdes.2021.110222.

Lin, W., X. Li, B. Tu, C. Zhang, and Y. Li. 2023. Wetting Kinetics, Spreading Phenomena and Interfacial Reaction of Sn-15Bi-xZn Solders on Cu Substrate at Different Temperatures. Soldering & Surface Mount Technology. 35: 218–230. https://doi.org/10.1108/SSMT-01-2023-0002.

Han, Y., J. Chen, S. Zhang, and Z. Yu. 2023. Early Wetting and Interfacial Behavior of Sn-Based Solder on Copper Substrates with Different Roughness. Soldering & Surface Mount Technology. 35: 331–343. https://doi.org/10.1108/SSMT-07-2023-0041.

Dharma, I. G. B. B., M. H. Abd Shukor, and T. Ariga. 2009. Wettability of Low Silver Content Lead-Free Solder Alloy. Materials Transactions. 50: 1135–1138. https://doi.org/10.2320/matertrans.M2009024.

Silva, B. L., G. L. Gouveia, N. Cheung, A. Garcia, and J. E. Spinelli. 2022. Analysis of Extensive Wetting Angle vs. Cooling Rate Data in Bi-, Zn- and Sn-Based Solder Alloys. Microelectronics Reliability. 135: 114593. https://doi.org/10.1016/j.microrel.2022.114593.

Shen, J., and Y. C. Chan. 2009. Effect of Metal/Ceramic Nanoparticle-Doped Fluxes on the Wettability between Sn–Ag–Cu Solder and a Cu Layer. Journal of Alloys and Compounds. 477: 909–914. https://doi.org/10.1016/j.jallcom.2008.11.015.

Abdullah, A., and S. R. Aisha Idris. 2023. A Review: Effect of Copper Percentage Solder Alloy after Laser Soldering. Soldering & Surface Mount Technology. 35: 175–188. https://doi.org/10.1108/SSMT-03-2022-0022.

Zhang, M., Z. Ma, G. Chen, F. Xia, and X. Yu. 2022. Spreading Behavior of Molten Solder with Alternative Currents under the Action of Electromagnetic Ultrasound. Journal of Materials Research and Technology. 18: 3700–3715. https://doi.org/10.1016/j.jmrt.2022.04.009.

Kotadia, H. R., P. D. Howes, and S. H. Mannan. 2014. A Review: On the Development of Low Melting Temperature Pb-Free Solders. Microelectronics Reliability. 54: 1253–1273. https://doi.org/10.1016/j.microrel.2014.02.025.

Li, H., L. Li, R. Huang, C. Tan, J. Yang, H. Xia, et al. 2021. The Effect of Surface Texturing on the Laser-Induced Wetting Behavior of AlSi5 Alloy on Ti6Al4V Alloy. Applied Surface Science. 566: 150630. https://doi.org/10.1016/j.apsusc.2021.150630.

Chen, S., Z. Xu, Z. Li, Z. Ma, L. Ma, and J. Yan. 2022. The Horizontal Sonocapillary Effect in Ultrasonic-Assisted Soldering. Welding Journal. 102. https://doi.org/10.29391/2023.102.009.

Sabri, M. F. M., S. B. M. Said, and D. A. Shnawah. 2015. Wetting Characteristics of Al-Containing Sn-1Ag-0.5Cu Solder Alloy on Cu Substrate Using Wetting Balance and Spread Area Methods. Procedia Technology. 20: 9–14. https://doi.org/10.1016/j.protcy.2015.07.003.

Huan, P.-C., X.-X. Tang, Q. Sun, A. K., X.-N. Wang, and J. Wang, et al. 2022. Comparative Study of Solder Wettability on Aluminum Substrate and Microstructure-Properties of Cu-Based Component/Aluminum Laser Soldering Joint. Materials & Design. 215: 110485. https://doi.org/10.1016/j.matdes.2022.110485.

Wang, X., F. Sun, B. Han, Y. Cao, J. Du, L. Shao, et al. 2022. Wetting Characteristics of Sn-5Sb-CuNiAg Lead-Free Solders on the Copper Substrate. Soldering & Surface Mount Technology. 34: 96–102. https://doi.org/10.1108/SSMT-01-2021-0001.

Shen, B., S. Yang, M. Xu, J. Zhao, G. Liu, M. Xie, et al. 2022. Effect of In Addition on Thermodynamic Properties, Wettability, Interface Microstructure, and Soldering Performance of SnBiAg–xIn/Cu Solder Joints. Metals. 12: 1594. https://doi.org/10.3390/met12101594.

Zhang, Z., Z. Yang, J. Qu, Y. Liu, J. Huang, and S. Chen, et al. 2022. Magnetron Sputtering Preparation of Cu6Sn5 Preferred-Orientation Coating and Its Influence on Wettability of Sn-Based Lead-Free Solder. Surface and Coatings Technology. 450: 129014. https://doi.org/10.1016/j.surfcoat.2022.129014.

Wang, R., Z. Yuan, B. Ma, L. Mei, H. Zhao, and B. Xu. 2023. Wetting Behavior and Mechanical Properties of Sn-10Sb Solder/Ni-Plated Cu System with Different Surface Structures. Vacuum. 217: 112480. https://doi.org/10.1016/j.vacuum.2023.112480.

Soares, T., C. Cruz, B. Silva, C. Brito, A. Garcia, J. E. Spinelli, et al. 2020. Interplay of Wettability, Interfacial Reaction and Interfacial Thermal Conductance in Sn-0.7Cu Solder Alloy/Substrate Couples. Journal of Electronic Materials. 49: 173–187. https://doi.org/10.1007/s11664-019-07454-6.

Peta, K., T. Bartkowiak, P. Galek, and M. Mendak. 2021. Contact Angle Analysis of Surface Topographies Created by Electric Discharge Machining. Tribology International. 163: 107139.

Drelich, J. W., L. Boinovich, E. Chibowski, C. Della Volpe, L. Hołysz, A. Marmur, et al. 2019. Contact Angles: History of Over 200 Years of Open Questions. Surface Innovations. 8: 3–27. https://doi.org/10.1680/jsuin.19.00007.

Saito, J., and M. Monbernier. 2023. Relationship between the Contact Angle of Pure Cu and Its Alloys Owing to Liquid Na and Electronic States at the Interface. Surfaces and Interfaces. 41: 103248. https://doi.org/10.1016/j.surfin.2023.103248.

Li, Y., Z. Wang, X. Li, and M. Lei. 2020. Effect of Temperature and Substrate Surface Roughness on Wetting Behavior and Interfacial Structure between Sn–35Bi–1Ag Solder and Cu Substrate. Journal of Materials Science: Materials in Electronics. 31: 4224–4236. https://doi.org/10.1007/s10854-020-02975-x.

Strauss, R. 1998. SMT Soldering Handbook. Amsterdam: Elsevier.

Kumar, G., and K. N. Prabhu. 2007. Review of Non-Reactive and Reactive Wetting of Liquids on Surfaces. Advances in Colloid and Interface Science. 133: 61–89. https://doi.org/10.1016/j.cis.2007.04.009.

Komolafe, B., and M. Medraj. 2014. Progress in Wettability Study of Reactive Systems. Journal of Metallurgy. 2014: 387046. https://doi.org/10.1155/2014/387046.

Hubbe, M. A., and D. J. Gardner. 2015. Contact Angles and Wettability of Cellulosic Surfaces: A Review of Proposed Mechanisms and Test Strategies. BioResources. 10.

AbdulKadir, W. A. F. W., A. L. Ahmad, O. B. Seng, and N. F. C. Lah. 2020. Biomimetic Hydrophobic Membrane: A Review of Anti-Wetting Properties as a Potential Factor in Membrane Development for Membrane Distillation (MD). Journal of Industrial and Engineering Chemistry. 91: 15–36. https://doi.org/10.1016/j.jiec.2020.08.005.

Stammitti-Scarpone, A., and E. J. Acosta. 2019. Solid-Liquid-Liquid Wettability and Its Prediction with Surface Free Energy Models. Advances in Colloid and Interface Science. 264: 28–46. https://doi.org/10.1016/j.cis.2018.10.003.

Downloads

Published

2026-06-16

Issue

Vol. 88 No. 4: July 2026

Section

Science and Engineering

License

Copyright of articles that appear in Jurnal Teknologi belongs exclusively to Penerbit Universiti Teknologi Malaysia (Penerbit UTM Press). This copyright covers the rights to reproduce the article, including reprints, electronic reproductions, or any other reproductions of similar nature.