EVALUATING THE ROLE OF CONDUCTIVE EPOXY COMPOSITE LAYER IN MULTI-LAYER CERAMIC CAPACITORS UNDER ENVIRONMENTAL AND THERMAL STRESSES

Authors

  • Muhamed Abdul Fatah Muhamed Mukhtar School of Materials & Mineral Resources Engineering, Engineering Campus, USM, 14300, Nibong Tebal, Penang, Malaysia https://orcid.org/0000-0002-3656-3783 (unauthenticated)
  • Syed Mohamad Mardzukey Syed Mohamed Zain Sandisk Storage Malaysia Sdn. Bhd., Plot 301A, Persiaran Cassia Selatan 1, Batu Kawan, 14100, Penang, Malaysia
  • Ibrahym Ahmad Sandisk Storage Malaysia Sdn. Bhd., Plot 301A, Persiaran Cassia Selatan 1, Batu Kawan, 14100, Penang, Malaysia
  • Maria Abu Bakar cInstitute of Microengineering and Nanoelectronics, Level 4, Research Complex, Universiti Kebangsaan Malaysia, 43600 Bangi, Selangor, Malaysia https://orcid.org/0000-0002-9745-3334 (unauthenticated)
  • Mohamad Riduwan Ramli School of Materials & Mineral Resources Engineering, Engineering Campus, USM, 14300, Nibong Tebal, Penang, Malaysia https://orcid.org/0000-0002-6207-748X (unauthenticated)

DOI:

https://doi.org/10.11113/jurnalteknologi.v88.25216

Keywords:

Cu-Epoxy Layer, Delamination, Thermal Cycling, Humidity Preconditioning, Surface Mount Assembly (SMA)

Abstract

Multi-Layer Ceramic Capacitors (MLCCs) are vital components in modern electronics, where reliability under harsh environmental and thermal conditions is essential. This study evaluates the role of conductive epoxy composite (Cu-Epoxy) layer in the MLCC during simulated reflow thermal cycling. Structural analysis revealed that the Cu-epoxy layer mitigates mechanical and thermal stresses in standard conditions, maintaining an intact interface. However, prolonged humidity exposure and thermal cycling led to delamination at the Cu-epoxy/Cu interface, compromising mechanical integrity and electrical performance. Elemental mapping confirmed alumina infiltration in delaminated area, providing evidence of structural degradation. These findings underscore the importance of optimizing reflow profiles and Cu-epoxy formulations to improve adhesion strength, moisture resistance, and thermal stability. This study offers actionable recommendations for enhancing MLCC reliability in surface mount assembly processes and demanding operating environments.

 

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Published

2026-08-29

Issue

Vol. 88 No. 5: September 2026

Section

Science and Engineering

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