INFLUENCE OF SPACE HOLDER ON RHEOLOGICAL BEHAVIOR OF COPPER FEEDSTOCKS FOR METAL INJECTION MOLDING

Authors

  • Mohammad Dahar Kamal Bahrin Centre for Advanced Materials Research (CAMAR), Fakulti Kejuruteraan Mekanikal, Universiti Teknologi MARA, Selangor, Malaysia
  • Nor ‘Aini Wahab Centre for Advanced Materials Research (CAMAR), Fakulti Kejuruteraan Mekanikal, Universiti Teknologi MARA, Selangor, Malaysia
  • Nor Amalina Nordin Centre for Advanced Materials Research (CAMAR), Fakulti Kejuruteraan Mekanikal, Universiti Teknologi MARA, Selangor, Malaysia
  • Muhammad Hussain Ismail Centre for Advanced Materials Research (CAMAR), Fakulti Kejuruteraan Mekanikal, Universiti Teknologi MARA, Selangor, Malaysia
  • Ismail Nasiruddin Ahmad Centre for Advanced Materials Research (CAMAR), Fakulti Kejuruteraan Mekanikal, Universiti Teknologi MARA, Selangor, Malaysia

DOI:

https://doi.org/10.11113/jt.v76.5695

Keywords:

Metal injection molding, copper, rheological behavior, viscosity, flow behavior index, activation energy.

Abstract

The characterization of MIM feedstock consisting of 63 vol% of copper powder with a binder system consisting of palm stearin (PS) and low density polyethylene (LDPE) was studied. To achieve porous structure, sodium chloride (NaCl) was added as a space holder. The effect of shear rate (s-1), temperature (oC) and viscosity (Pa.s) on the rheological behavior of solid and porous copper feedstocks were investigated by using the Rosand RH2000 Capillary Rheometer at temperatures of 160, 170 and 180oC. The feedstocks achieved desirable injection molding characteristics such as pseudo-plastic behaviour, stable flow, flow behavior index less than 1 (n<1) and low activation energy (E). It can be concluded from the analysis that both feedstocks showed a good pseudo-plastic behavior within acceptable ranges in MIM. 

References

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Published

2015-09-29

Issue

Section

Science and Engineering

How to Cite

INFLUENCE OF SPACE HOLDER ON RHEOLOGICAL BEHAVIOR OF COPPER FEEDSTOCKS FOR METAL INJECTION MOLDING. (2015). Jurnal Teknologi (Sciences & Engineering), 76(6). https://doi.org/10.11113/jt.v76.5695