3D MODELLING OF ELECTRICAL CAPACITANCE AND ULTRASONIC SENSOR INTEGRATION USING FINITE ELEMENT METHOD

Authors

  • Jaysuman Pusppanathan Process Tomography and Instrumentation Engineering Research Group (PROTOM-i), Infocomm Research Alliance
  • Ruzairi Abdul Rahim Process Tomography and Instrumentation Engineering Research Group (PROTOM-i), Infocomm Research Alliance
  • Fatin Aliah Phang Department of Mechatronics and Robotics Engineering, Faculty of Electrical and Electronic Engineering, Universiti Tun Hussein Onn Malaysia, 86400 Batu Pahat, Johor, Malaysia
  • Khairul Hamimah Abas Process Tomography and Instrumentation Engineering Research Group (PROTOM-i), Infocomm Research Alliance
  • Shafishuhaza Sahlan Process Tomography and Instrumentation Engineering Research Group (PROTOM-i), Infocomm Research Alliance
  • Elmy Johana Mohamad Department of Mechatronics and Robotics Engineering, Faculty of Electrical and Electronic Engineering, Universiti Tun Hussein Onn Malaysia, 86400 Batu Pahat, Johor, Malaysia

DOI:

https://doi.org/10.11113/jt.v77.6422

Keywords:

Tomography, electrical capacitance, comsol, finite element analysis, sensor guard

Abstract

This paper presents a three dimensional (3D) modelling of a dual modality sensor composite which emerges electrical capacitance sensor (ES) and ultrasonic transducer (UT) for process tomography applications. The dual-modality tomography (DMT) setup has employed a customized ES electrodes along with UT on a single-plane. A finite element method is used to analyze the feasibility and the behavior of the DMT setup in 3D environment using COMSOL Multiphysics software. This simulation is performed both in a homogeneous and inhomogeneous conditions to investigate the wave distribution and its pattern thus the simulation results are presented in this paper.

References

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Published

2015-11-24

How to Cite

3D MODELLING OF ELECTRICAL CAPACITANCE AND ULTRASONIC SENSOR INTEGRATION USING FINITE ELEMENT METHOD. (2015). Jurnal Teknologi (Sciences & Engineering), 77(17). https://doi.org/10.11113/jt.v77.6422