Reducing Friction During Drilling In Water–Based Mud Using Glass Beads

Authors

  • Issham Ismail
  • Azmi Kamis
  • Nur Suriani Mamat

DOI:

https://doi.org/10.11113/jt.v55.76

Abstract

Artikel ini mengetengahkan perbincangan tentang penggunaan butiran kaca sebagai agen pelincir berikutan sifatnya yang lengai, tidak menghakis, dan bebas toksik. Saiz butiran kaca yang digunakan adalah dalam julat 22 hingga 163 μm. Hasil kajian menunjukkan bahawa lumpur dasar air yang mengandungi butiran kaca berjaya mengurangkan pekali geseran sebanyak 41% berbanding lumpur dasar air tanpa butiran kaca. Penggunaan 4 ppb butiran kaca dalam lumpur dasar air didapati telah menghasilkan sifat–sifat reologi yang optimum dan kehilangan bendalir yang paling rendah jika dibandingkan dengan lumpur tanpa butiran kaca dan lumpur dengan 2 ppb dan 6 ppb butiran kaca. Keputusan uji kaji juga menunjukkan bahawa karbolit mempunyai potensi untuk digunakan sebagai agen pelincir dalam lumpur dasar air. Kata kunci: pekali geseran; karbolit; butiran kaca; agen pelincir; lumpur dasar air This paper discusses the use of glass beads as a lubricating agent, which was considered as it is chemically inert, non–abrasive, and non–toxic. The glass beads size used were in the range of 22 to 163 μm. The experimental results showed that water–based mud with glass beads experiencing 41% reduction of coefficient of friction (CoF) compared to water–based mud without glass beads The presence of 4 ppb of glass beads in water–based mud was found to have given the optimum rheological properties and lowest fluid loss than mud without glass beads and with 2 ppb and 6 ppb of glass beads. The experimental results also revealed that carbolite has the potential to be used as a lubricating agent in water–based mud. Key words: coefficient of friction; carbolite; glass beads; lubricating agent; water–based mud

Downloads

Published

2011-12-14

Issue

Section

Science and Engineering

How to Cite

Reducing Friction During Drilling In Water–Based Mud Using Glass Beads. (2011). Jurnal Teknologi, 55(1), 39–52. https://doi.org/10.11113/jt.v55.76