Effect of Soldier Bump Size On Interfacial Reactions During Soldering Between PB–Free Solder and Cu and Cu Ni/Pd/Au Surface Finishes. Jurnal Teknologi, [S. l.], v. 52, n. 1, p. 1–12, 2012. DOI: 10.11113/jt.v52.118. Disponível em: https://journals.utm.my/jurnalteknologi/article/view/118.. Acesso em: 23 jul. 2024.