Effect of Soldier Bump Size On Interfacial Reactions During Soldering Between PB–Free Solder and Cu and Cu Ni/Pd/Au Surface Finishes.
Jurnal Teknologi (Sciences & Engineering),
[S. l.], v. 52, n. 1, p. 1–12, 2012.
DOI: 10.11113/jt.v52.118. Disponível em: https://journals.utm.my/jurnalteknologi/article/view/118.. Acesso em: 19 feb. 2025.