THERMAL-INDUCED DAMAGE ON SOLDER JOINTS OF HIGH-DENSITY ADJACENT BALL GRID ARRAY COMPONENTS DURING THE REWORK PROCESS. Jurnal Teknologi, [S. l.], v. 84, n. 6-2, p. 1–8, 2022. DOI: 10.11113/jurnalteknologi.v84.19321. Disponível em: https://journals.utm.my/jurnalteknologi/article/view/19321.. Acesso em: 3 may. 2024.