QUAD FLAT NO-LEAD PACKAGE WITH DIFFERENT THERMAL PROFILES AND SOLDER PAD FINISHING FOR VOID MINIMIZATION. Jurnal Teknologi, [S. l.], v. 84, n. 6-2, p. 65–75, 2022. DOI: 10.11113/jurnalteknologi.v84.19344. Disponível em: https://journals.utm.my/jurnalteknologi/article/view/19344.. Acesso em: 4 may. 2024.