“THERMAL-INDUCED DAMAGE ON SOLDER JOINTS OF HIGH-DENSITY ADJACENT BALL GRID ARRAY COMPONENTS DURING THE REWORK PROCESS”. Jurnal Teknologi (Sciences & Engineering) 84, no. 6-2 (October 31, 2022): 1–8. Accessed December 5, 2025. https://journals.utm.my/jurnalteknologi/article/view/19321.