THERMAL-INDUCED DAMAGE ON SOLDER JOINTS OF HIGH-DENSITY ADJACENT BALL GRID ARRAY COMPONENTS DURING THE REWORK PROCESS. J. Teknol. [Internet]. 2022 Oct. 31 [cited 2024 Dec. 19];84(6-2):1-8. Available from: https://journals.utm.my/jurnalteknologi/article/view/19321